THERM-A-GAP GEL 60HF is a high performance, one component, silicone based, fully cured, dispensable thermal interface material with 6.2 W/m-k thermal conductivity.

THERM-A-GAP GEL 60HF is a High Flow (HF) gel and is ideal for high volume dispensing applications and high throughput production operations.  GEL 60HF requires no mixing or curing and is designed for easy application, rework and field repair situations.

THERM-A-GAP GEL 60HF enables tightly controlled dispensing and accurate material placement during assembly.  GEL 60HF requires low compression forces to deform under assembly pressure.

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Additional Information

  • THERM-A-GAP GEL60HF  is easily dispensable and does not require a secondary curing.
  • THERM-A-GAP GEL60HF’s typical applications include: Consumer Electronics, Telecommunication Equipment, Energy Storage Devices, Power Electronics and Modules, Automotive Control Units and Sensors, and Computing Components (CPUs, GPUs, Memory)