Additional Information
- CHO-BOND 4669 is designed to be used as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
- CHO-BOND 4669’s non-hardening characteristic makes it particularly suited for shielding joints and seams which are likely to be disassembled or applications where vibrations and thermal shock resilience are required.
- CHO-BOND 4669 is the extended working life (2 hours) version of CHO-BOND 4660.
- Typical applications for CHO-BOND 4669 include access panels, shielded room joints, temporary military shelters, hardware, bulkhead feedthrough fittings, and building conduits.