CHO-BOND 4669 is a one-component, silver-plated copper-filled, electrically conductive polyisobutylene sealant formulated for extended working life and flexibility within applications where vibration resistance is required.

Call 978-777-3837 for more information regarding this product.

Would you like to include...

Part Number: 51-02-4669-0000 Category:

Additional Information

  • CHO-BOND 4669 is designed to be used as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
  • CHO-BOND 4669’s non-hardening characteristic makes it particularly suited for shielding joints and seams which are likely to be disassembled or applications where vibrations and thermal shock resilience are required.
  • CHO-BOND 4669 is the extended working life (2 hours) version of CHO-BOND 4660.
  • Typical applications for CHO-BOND 4669 include access panels, shielded room joints, temporary military shelters, hardware, bulkhead feedthrough fittings, and building conduits.