CHO-BOND 584-208

CHO-BOND 584-208 is a two-component, silver-filled, electrically conductive epoxy formulated with an extended working life making it ideal for high volume applications where a strong electrical bond is required.

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Part Number: 50-XX-0584-0208 Category:

Features and Benefits

  • Silver filler is a premium conductivity solution to electrical bonding
  • Excellent conductivity levels (0.002 ohm-com)
  • Strong adhesion properties (>1000 PSI lap shear strength)
  • Medium paste makes it effective for overhead and vertical surface applications
  • Can be easily dispensed from a small needle for small cracks and voids
  • Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options
  • No volatile organic compounds
  • 1:1 mix ratio makes measurement and application very easy