Features and Benefits
- Silver filler is a premium conductivity solution to electrical bonding
- Excellent conductivity levels (0.002 ohm-com)
- Strong adhesion properties (>1000 PSI lap shear strength)
- Medium paste makes it effective for overhead and vertical surface applications
- Can be easily dispensed from a small needle for small cracks and voids
- Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options
- No volatile organic compounds
- 1:1 mix ratio makes measurement and application very easy
