THERM-A-GAP GEL 25NS is a high performance, one component, dispensable thermal interface material with a 2.5 W/m-K thermal conductivity that was developed to conduct heat from electronics to a heat sink or enclosure.

This is a non-silicone (NS) thermal gel and is ideal for applications where silicone contamination is an issue and requires no mixing or curing.

THERM-A-GAP GEL 25NS’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses.  GEL 25NS also requires low compression force to deform under assembly pressure.

Common Gel 25NS packaging is available for online purchase; however, alternative packaging is available.

Call 978-777-3837 for more information regarding this product.

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Additional Information

  • THERM-A-GAP GEL 25NS is easily dispense and does not require a secondary curing.
  • THERM-A-GAP GEL 25NSs typical application include: telecom base stations, power supplies and semi-conductors, memory and power modules, microprocessors, and central processing units (CPUs).