THERM-A-GAP GEL 25NS is a high performance, one component, dispensable thermal interface material with a 2.5 W/m-K thermal conductivity that was developed to conduct heat from electronics to a heat sink or enclosure.
This is a non-silicone (NS) thermal gel and is ideal for applications where silicone contamination is an issue and requires no mixing or curing.
THERM-A-GAP GEL 25NS’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses. GEL 25NS also requires low compression force to deform under assembly pressure.
Common Gel 25NS packaging is available for online purchase; however, alternative packaging is available.
Call 978-777-3837 for more information regarding this product.
