Additional Information
- CHO-BOND 2165 provides a conductive, corrosion resistant protective compound for aluminum airframes used in conjunctions with Parker Chomerics CHO-SHIELD 2000 series EMI coatings.
- CHO-BOND 2165 is a good compound choice for EMI shielding and electrical grounding applications.
- CHO-BOND 2165 is a thick conductive paste that may be used as a fastener fill, gap fill, or repair compound for aircraft.
- CHO-BOND 2165 achieves full properties in less than 4 hours with a combination room temperature cure plus a 113 degree cure minimizing aircraft downtime.
