CHO-BOND 584-29

CHO-BOND 584-29 is an easy to use, two-component, silver-filled, electrically conductive epoxy formulated for thin bond lines and precise application. This product is available in various sizes and applicators to suit your needs.

More information regarding the convenient syringe-paks can be found here.

Call 978-777-3837 for more information regarding this product.

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Additional Information

The fine silver filler of CHO-BOND 584-29 makes it a good material choice for precise application in and around tight spaces and electrical components.  CHO-BOND 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size that is right for their application.

The curing of CHO-BOND 584-29 can be achieved in as little as 15 minutes. Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing of machined enclosures.

Video (Syringe)

Video (Bi-pak)