Additional Information
The fine silver filler of CHO-BOND 584-29 makes it a good material choice for precise application in and around tight spaces and electrical components. CHO-BOND 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size that is right for their application.
The curing of CHO-BOND 584-29 can be achieved in as little as 15 minutes. Typical applications include bonding and grounding of electrical components, cold soldering, and bonding and sealing of machined enclosures.
