CHO-BOND 2165 is a two-component, stabilized-copper filled, polyurethane, corrosion resistant sealant specifically formulated for aerospace and military applications.

Note: CHO-BOND 2165 is designed to be used in conjunction with the CHO-SHIELD 1091 Primer which is sold separately.

Call 978-777-3837 for more information regarding this product.

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Part Number: 50-XX-2165-0000 Category:

Additional Information

  • CHO-BOND 2165 provides a conductive, corrosion resistant protective compound for aluminum airframes used in conjunctions with Parker Chomerics CHO-SHIELD 2000 series EMI coatings.
  • CHO-BOND 2165 is a good compound choice for EMI shielding and electrical grounding applications.
  • CHO-BOND 2165 is a thick conductive paste that may be used as a fastener fill, gap fill, or repair compound for aircraft.
  • CHO-BOND 2165 achieves full properties in less than 4 hours with a combination room temperature cure plus a 113 degree cure minimizing aircraft downtime.