CHO-BOND 360-20

CHO-BOND 360-20 is a two-component, silver-plated copper filled, electrically conductive epoxy formulated for exceptionally strong electrical bonds.

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Part Number: 50-00-0360-0020 Category:

Additional Information

  • The silver-copper filler of CHO-BOND 360-20 provides a cost-effective alternative to pure silver conductive epoxies in applications where moderate conductivity is acceptable.
  • CHO-BOND 360-20 is a thick paste making it ideal for filling rather large bond lines and cracks in electrical boxes and enclosures.
  • The curing of CHO-BOND 360-20 can be achieved in as little as 15 minutes with heat.
  • CHO-BOND 360-20 has a 60-minute working life and works well over a wide temperature range.
  • The 1:1 weight/mix ratio makes CHO-BOND 360-20 easy to handle and use.
  • Typical applications include poorly tolerance enclosures or casting, EMI vents and windows, and vertical and overhead fillet application