Additional Information
- CHO-BOND 4660 is designed to be used as a fillet, gap filler, and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
- CHO-BOND 4660’s non-hardening characteristic makes it particularly suited for shielding joints and seams which are likely to be disassembled or applications where vibrations and thermal shock resilience are required.
- Typical applications for CHO-BOND 4660 include access panels, shielded room joints, temporary military shelters, hardware, bulkhead feedthrough fittings, and building conduits.
